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ECE 544 Design Of Electronic Packaging and Interconnects
贰颁贰听544听听Design Of Electronic Packaging and Interconnects听听(3 credit hours)听听
A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues.
Prerequisite: 贰颁贰听302
Typically offered in Spring only