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This course on semiconductor manufacturing focuses on high-volume production, process optimization, automation, and yield improvement, distinct from semiconductor fabrication courses. It covers the full manufacturing pipeline--from wafer production and process integration to packaging, reliability, and cost optimization. Students will explore design for manufacturability (DFM), statistical process control (SPC), metrology, defect inspection, and smart manufacturing technologies such as AI-driven automation. Hands-on components include cleanroom process control (if available), semiconductor fab simulations, defect analysis, yield optimization exercises, packaging assembly, and failure analysis labs. The course concludes with an industry case study competition and a guest lecture from a semiconductor manufacturing expert, ensuring students gain both theoretical and practical insights into modern semiconductor manufacturing challenges and solutions.

Prerequisite: Graduate Standing

Typically offered in Summer only